Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Chao Yang0
Louis C. Hsu0
Rajiv V. Joshi0
Date of Patent
June 8, 2010
0Patent Application Number
119701490
Date Filed
January 7, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The invention is directed to an improved semiconductor structure, such that within the same insulating layer, Cu interconnects embedded within the same insulating level layer have a different Cu grain size than other Cu interconnects embedded within the same insulating level layer.
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