US Patent 7732922 Simultaneous grain modulation for BEOL applications
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Patent abstract
The invention is directed to an improved semiconductor structure, such that within the same insulating layer, Cu interconnects embedded within the same insulating level layer have a different Cu grain size than other Cu interconnects embedded within the same insulating level layer.
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Patent Inventor Names
Chih-Chao Yang0
Louis C. Hsu0
Rajiv V. Joshi0
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US Patent 07732922 Simultaneous grain modulation for BEOL applications US Patent 7732922 Simultaneous grain modulation for BEOL applications
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Patent Number
077329220
Patent Number
77329220
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Patent Jurisdiction
Patent Number
077329220
Date of Patent
June 8, 2010
0Patent Application Number
119701490
Date Filed
January 7, 2008
0Official Website
Patent Primary Examiner
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US Patent 07732922 Simultaneous grain modulation for BEOL applications
Infobox
Is a
Patent jurisdiction
Patent number
07732922
Date of patent
June 8, 2010
Patent application number
11970149
Date Filed
January 7, 2008
Patent primary examiner
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