Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toshiyuki Yoshikawa0
Date of Patent
June 15, 2010
Patent Application Number
11806847
Date Filed
June 4, 2007
Patent Primary Examiner
Patent abstract
A method of dividing a wafer having a plurality of areas defined by the plurality of streets formed in a lattice on the front surface, devices formed in the defined areas and an adhesive film for die bonding on the rear surface and put on a dicing tape affixed to an annular frame along the streets, the method comprising the steps of:
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