US Patent 7737002 Wafer dividing method
Patent 7737002 was granted and assigned to Disco Corporation on June, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A method of dividing a wafer having a plurality of areas defined by the plurality of streets formed in a lattice on the front surface, devices formed in the defined areas and an adhesive film for die bonding on the rear surface and put on a dicing tape affixed to an annular frame along the streets, the method comprising the steps of:
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Patent Inventor Names
Toshiyuki Yoshikawa0
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US Patent 07737002 Wafer dividing method US Patent 7737002 Wafer dividing method
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Patent Number
07737002
Patent Number
7737002
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US Patent 07737002 Wafer dividing method
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Current assignee
Patent jurisdiction
Patent number
07737002
Date of patent
June 15, 2010
Patent application number
11806847
Date Filed
June 4, 2007
Patent primary examiner
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