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US Patent 7741724 Semiconductor device
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Patent
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Date Filed
April 1, 2008
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Date of Patent
June 22, 2010
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Patent Application Number
12060673
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Patent Citations Received
US Patent 11715730 Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
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US Patent 11762200 Bonded optical devices
US Patent 11860415 Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
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US Patent 11881454 Stacked IC structure with orthogonal interconnect layers
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US Patent 11887949 Bond pad layout including floating conductive sections
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US Patent 11894345 Integrated voltage regulator and passive components
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Patent Inventor Names
Shigehiro Morikawa
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Yuichi Inaba
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Yuji Goto
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
7741724
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Patent Primary Examiner
Leonardo Andujar
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