Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 29, 2010
Patent Application Number
12125250
Date Filed
May 22, 2008
Patent Primary Examiner
Patent abstract
An assembly structure is provided. The assembly structure includes a first substrate, a second substrate and a medium layer disposed between the first and second substrates. The medium layer includes a side edge, and the second substrate includes at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer.
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