US Patent 7745726 Assembly structure
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Patent abstract
An assembly structure is provided. The assembly structure includes a first substrate, a second substrate and a medium layer disposed between the first and second substrates. The medium layer includes a side edge, and the second substrate includes at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer.
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US Patent 07745726 Assembly structure US Patent 7745726 Assembly structure
Infobox
Patent Number
0774572600
Patent Number
774572600
Edits on 25 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077457260
Date of Patent
June 29, 2010
0Patent Application Number
121252500
Date Filed
May 22, 2008
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077457260
Date of Patent
June 29, 2010
0Patent Application Number
121252500
Date Filed
May 22, 2008
0Official Website
Patent Primary Examiner
Edits on 3 Jun, 2022
Golden AI
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Golden AI
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US Patent 07745726 Assembly structure
Infobox
Is a
Patent jurisdiction
Patent number
07745726
Date of patent
June 29, 2010
Patent application number
12125250
Date Filed
May 22, 2008
Patent primary examiner
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