Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 29, 2010
Patent Application Number
11383407
Date Filed
May 15, 2006
Patent Primary Examiner
Patent abstract
An offset integrated circuit package-on-package stacking system is provided including providing a base substrate, providing an array of contact pads on the base substrate, mounting an active component and an optional passive component on the base substrate, injecting a mold cap on the base substrate, mounting an offset package on the base substrate and the mold cap, and singulating a package-on-package from the base substrate.
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