US Patent 7746656 Offset integrated circuit package-on-package stacking system
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Patent abstract
An offset integrated circuit package-on-package stacking system is provided including providing a base substrate, providing an array of contact pads on the base substrate, mounting an active component and an optional passive component on the base substrate, injecting a mold cap on the base substrate, mounting an offset package on the base substrate and the mold cap, and singulating a package-on-package from the base substrate.
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US Patent 07746656 Offset integrated circuit package-on-package stacking system US Patent 7746656 Offset integrated circuit package-on-package stacking system
Infobox
Patent Number
0774665600
Patent Number
774665600
Edits on 4 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077466560
Date of Patent
June 29, 2010
0Patent Application Number
113834070
Date Filed
May 15, 2006
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077466560
Date of Patent
June 29, 2010
0Patent Application Number
113834070
Date Filed
May 15, 2006
0Official Website
Patent Primary Examiner
Edits on 3 Jun, 2022
Golden AI
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Golden AI
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US Patent 07746656 Offset integrated circuit package-on-package stacking system
Infobox
Is a
Patent jurisdiction
Patent number
07746656
Date of patent
June 29, 2010
Patent application number
11383407
Date Filed
May 15, 2006
Patent primary examiner
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