Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Nisha Ananthakrishnan0
Nirupama Chakrapani0
Vijay S Wakharkar0
Shankar Ganapathysubramanian0
Gregory S Constable0
Janet Feng0
Date of Patent
July 20, 2010
0Patent Application Number
122423980
Date Filed
September 30, 2008
0Patent Primary Examiner
Patent abstract
A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.
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