US Patent 7759780 Microelectronic package with wear resistant coating
Patent 7759780 was granted and assigned to Intel on July, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.
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Patent Inventor Names
Gregory S Constable0
Janet Feng0
Nirupama Chakrapani0
Nisha Ananthakrishnan0
Shankar Ganapathysubramanian0
Vijay S Wakharkar0
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US Patent 07759780 Microelectronic package with wear resistant coating US Patent 7759780 Microelectronic package with wear resistant coating
Infobox
Patent Number
077597800
Patent Number
77597800
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077597800
Date of Patent
July 20, 2010
0Patent Application Number
122423980
Date Filed
September 30, 2008
0Official Website
Patent Primary Examiner
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US Patent 07759780 Microelectronic package with wear resistant coating
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07759780
Date of patent
July 20, 2010
Patent application number
12242398
Date Filed
September 30, 2008
Patent primary examiner
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