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US Patent 7759957 Method for fabricating a test structure

Patent 7759957 was granted and assigned to United Microelectronics Corporation on July, 2010 by the United States Patent and Trademark Office.

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Patent abstract

A method for fabricating a test structure, in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.

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