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US Patent 7759957 Method for fabricating a test structure

Patent 7759957 was granted and assigned to United Microelectronics Corporation on July, 2010 by the United States Patent and Trademark Office.

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Patent abstract

A method for fabricating a test structure, in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.

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Patent Inventor Names
Kuan-Cheng Su0
Wen-Chun Chang0
Wen-Hsiung Ko0
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US Patent 07759957 Method for fabricating a test structure US Patent 7759957 Method for fabricating a test structure

Infobox
Patent Number
077599570
Patent Number
77599570
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edited on 23 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=077599570
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Infobox
Is a
Patent
Patent
0
Current Assignee
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
077599570
Date of Patent
July 20, 2010
0
Patent Application Number
118291040
Date Filed
July 27, 2007
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=077599570
Patent Primary Examiner
‌
Vinh P Nguyen
0
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07759957
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 US Patent 07759957 Method for fabricating a test structure

Infobox
Is a
Patent
Patent
Current assignee
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07759957
Date of patent
July 20, 2010
Patent application number
11829104
Date Filed
July 27, 2007
Patent primary examiner
‌
Vinh P Nguyen

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