US Patent 7763146 Disassembly method and reuse method of substrate mounting member
Patent 7763146 was granted and assigned to NGK Insulators on July, 2010 by the United States Patent and Trademark Office.
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Patent abstract
An electrostatic chuck and a base member are separated from each other while heating up a substrate mounting member to a thermal decomposition temperature within a range from a thermal decomposition starting temperature to a thermal decomposition ending temperature and then softening and decomposing an organic adhesive layer.
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US Patent 07763146 Disassembly method and reuse method of substrate mounting member US Patent 7763146 Disassembly method and reuse method of substrate mounting member
Infobox
Patent Number
0776314600
Patent Number
776314600
Edits on 28 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077631460
Date of Patent
July 27, 2010
0Patent Application Number
115540990
Date Filed
October 30, 2006
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077631460
Date of Patent
July 27, 2010
0Patent Application Number
115540990
Date Filed
October 30, 2006
0Official Website
Patent Primary Examiner
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US Patent 07763146 Disassembly method and reuse method of substrate mounting member
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07763146
Date of patent
July 27, 2010
Patent application number
11554099
Date Filed
October 30, 2006
Patent primary examiner
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