Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 27, 2010
Patent Application Number
12394390
Date Filed
February 27, 2009
Patent Primary Examiner
Patent abstract
An acidic post-CMP cleaning composition includes at least one polyamino-polycarboxylic acid, or salt thereof; at least one hydroxycarboxylic acid, or salt thereof; and the remainder being substantially water. The acidic cleaning composition also includes a surfactant. The acidic post-CMP cleaning composition has a pH of 1 to 5, and is useful for removing the contaminants from the wafer surface after a CMP process without making roughness worse.
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