US Patent 7763962 Wafer-level packaging of micro devices
Patent 7763962 was granted and assigned to Spatial Photonics on July, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 10, 2006
0
Date of Patent
July 27, 2010
0
Patent Application Number
11558883
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Patent Inventor Names
Vlad Novotny
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Shaoher X. Pan
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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