Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Alex Bratkovski0
Chandrakant Patel0
Shih-Yuan Wang0
Date of Patent
July 27, 2010
0Patent Application Number
117844630
Date Filed
April 5, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
In an embodiment, an integrated heat sink for a microchip includes a substrate having a plurality of interconnected electronic devices formed in a plurality of layers. At least one heat sink element is interposed within the layers and includes a microchannel to provide a fluid flow path for heat transfer. Other embodiments include a method of making an integrated heat sink for a microchip.
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