US Patent 7763973 Integrated heat sink for a microchip
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Patent abstract
In an embodiment, an integrated heat sink for a microchip includes a substrate having a plurality of interconnected electronic devices formed in a plurality of layers. At least one heat sink element is interposed within the layers and includes a microchannel to provide a fluid flow path for heat transfer. Other embodiments include a method of making an integrated heat sink for a microchip.
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Patent Inventor Names
Alex Bratkovski0
Chandrakant Patel0
Shih-Yuan Wang0
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US Patent 07763973 Integrated heat sink for a microchip US Patent 7763973 Integrated heat sink for a microchip
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Patent Number
077639730
Patent Number
77639730
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Official Website
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Patent Jurisdiction
Patent Number
077639730
Date of Patent
July 27, 2010
0Patent Application Number
117844630
Date Filed
April 5, 2007
0Official Website
Patent Primary Examiner
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US Patent 07763973 Integrated heat sink for a microchip
Infobox
Is a
Patent jurisdiction
Patent number
07763973
Date of patent
July 27, 2010
Patent application number
11784463
Date Filed
April 5, 2007
Patent primary examiner
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