Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 3, 2010
Patent Application Number
11326211
Date Filed
January 4, 2006
Patent Primary Examiner
Patent abstract
A chip package system is provided including providing a chip having interconnects provided thereon; forming a molding compound on the chip and encapsulating the interconnects; and forming a recess in the molding compound above the interconnects to expose the interconnects.
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