US Patent 7768125 Multi-chip package system
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Patent abstract
A chip package system is provided including providing a chip having interconnects provided thereon; forming a molding compound on the chip and encapsulating the interconnects; and forming a recess in the molding compound above the interconnects to expose the interconnects.
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US Patent 07768125 Multi-chip package system US Patent 7768125 Multi-chip package system
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Patent Number
0776812500
Patent Number
776812500
Edits on 19 May, 2023
Golden AI
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Official Website
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Infobox
Is a
Patent Jurisdiction
Patent Number
077681250
Date of Patent
August 3, 2010
0Patent Application Number
113262110
Date Filed
January 4, 2006
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
077681250
Date of Patent
August 3, 2010
0Patent Application Number
113262110
Date Filed
January 4, 2006
0Official Website
Patent Primary Examiner
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Golden AI
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US Patent 07768125 Multi-chip package system
Infobox
Is a
Patent jurisdiction
Patent number
07768125
Date of patent
August 3, 2010
Patent application number
11326211
Date Filed
January 4, 2006
Patent primary examiner
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