Patent attributes
The present invention provides three-dimensional force input control devices for use in sensing vector forces and converting them into electronic signals for processing in a electronic signal processing system with all components within die fabricated from the single semiconductor substrate. In some embodiments, the die has an elastic element, a frame formed around said elastic element, at least three mechanical stress sensitive IC components located in the elastic element, at rigid island element which transfers an external vector force to the elastic element and through the IC components provides electrical output signal, this rigid island has a height bigger than the thickness of the frame element, an external force-transferring element coupling the rigid island element with an external force and electronic circuit for processing output signals from the mechanical stress sensitive IC components.
