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US Patent 7772686 Memory card fabricated using SiP/SMT hybrid technology

Patent 7772686 was granted and assigned to SanDisk on August, 2010 by the United States Patent and Trademark Office.

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Patent abstract

A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

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