US Patent 7772686 Memory card fabricated using SiP/SMT hybrid technology
Patent 7772686 was granted and assigned to SanDisk on August, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
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Patent Inventor Names
Andre McKenzie0
Cheemen Yu0
Hem Takiar0
Ning Ye0
Robert C. Miller0
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US Patent 07772686 Memory card fabricated using SiP/SMT hybrid technology US Patent 7772686 Memory card fabricated using SiP/SMT hybrid technology
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Patent Number
077726860
Patent Number
77726860
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Official Website
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
077726860
Date of Patent
August 10, 2010
0Patent Application Number
117699540
Date Filed
June 28, 2007
0Official Website
Patent Primary Examiner
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US Patent 07772686 Memory card fabricated using SiP/SMT hybrid technology
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07772686
Date of patent
August 10, 2010
Patent application number
11769954
Date Filed
June 28, 2007
Patent primary examiner
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