US Patent 7776199 Printed wiring board and production method thereof

Patent 7776199 was granted and assigned to Fujikura on August, 2010 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Fujikura

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7776199

Date of Patent

August 17, 2010

Patent Application Number

10567779

Date Filed

August 11, 2004

Patent Primary Examiner

‌

Luan V Van

Patent abstract

The present invention provides a printed wiring board free from undercuts, which can be formed by an additive method without a dry treatment and a dry treatment apparatus, and a production method thereof. A printed wiring board of the present invention has a conductor circuit free from undercuts which is produced by carrying out additional plating to fill undercuts.

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