US Patent 7776199 Printed wiring board and production method thereof
Patent 7776199 was granted and assigned to Fujikura on August, 2010 by the United States Patent and Trademark Office.
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Patent abstract
The present invention provides a printed wiring board free from undercuts, which can be formed by an additive method without a dry treatment and a dry treatment apparatus, and a production method thereof. A printed wiring board of the present invention has a conductor circuit free from undercuts which is produced by carrying out additional plating to fill undercuts.
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US Patent 07776199 Printed wiring board and production method thereof US Patent 7776199 Printed wiring board and production method thereof
Infobox
Patent Number
0777619900
Patent Number
777619900
Edits on 24 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077761990
Date of Patent
August 17, 2010
0Patent Application Number
105677790
Date Filed
August 11, 2004
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077761990
Date of Patent
August 17, 2010
0Patent Application Number
105677790
Date Filed
August 11, 2004
0Official Website
Patent Primary Examiner
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US Patent 07776199 Printed wiring board and production method thereof
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07776199
Date of patent
August 17, 2010
Patent application number
10567779
Date Filed
August 11, 2004
Patent primary examiner
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