Patent 7777956 was granted and assigned to University of Utah on August, 2010 by the United States Patent and Trademark Office.
A method of fabricating a sub-millimeter scale curved surface on a substrate (10) includes cutting a plurality of trenches (12) of varying depth into the substrate (10). The depth of the trenches (12) corresponds to a desired surface profile. The substrate (10) is etched to remove material left (16) between the trenches to form the curved surface.