Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Alois Nitsch0
Date of Patent
August 24, 2010
Patent Application Number
12178307
Date Filed
July 23, 2008
Patent Primary Examiner
Patent abstract
A semiconductor device includes a first die, a substrate, and a first interconnect. The first die includes a first isolation region and a first contact at least partially overlapping the first isolation region. The substrate includes a second contact. The first interconnect couples the first contact to the second contact. The first interconnect is defined by a via through the first isolation region.
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