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US Patent 7784164 Electronic device manufacturing chamber method

Patent 7784164 was granted and assigned to Applied Materials on August, 2010 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent attributes

Current Assignee

Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Donald Verplancken0

John M. White0

Shinichi Kurita0

Date of Patent

August 31, 2010

Patent Application Number

11214475

Date Filed

August 29, 2005

Patent Citations Received

US Patent 12080571 Substrate processing module and method of moving a workpiece

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US Patent 11674227 Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure

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US Patent 11749542 Apparatus, system, and method for non-contact temperature monitoring of substrate supports

US Patent 12002668 Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

0

0

Patent Primary Examiner

Jermie E. Cozart

Patent abstract

A non-polygon shaped, multi-piece chamber is provided. A non-polygon shaped, multi-piece chamber may include (1) a central piece having a first side and a second side, (2) a first side piece adapted to couple with the first side of the central piece, and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece, and the second side piece form a cylindrical overall shape when coupled together. Numerous other aspects are provided.

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