US Patent 7785091 Processing apparatus and device manufacturing method

A processing apparatus configured to transfer a pattern of a mold onto a target member by pressing the mold against a resin applied to the target member includes a driver configured to move the mold and the target member relative to each other, and a controller configured to control the driver so that a changing rate of a load generated between the mold and the resin in a first state is smaller than that in a second state, and the first state being a state in which the mold that adheres to the resin starts moving in a direction separating from the resin, and the second state being a state in which the mold that moves in the direction separating from the resin is about to separate from the resin.