Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroki Fukatsu0
Hirokazu Ohshiba0
Toshio Shiwaku0
Kazufumi Watanabe0
Date of Patent
September 7, 2010
Patent Application Number
10592362
Date Filed
March 24, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention provides a very thin planar connector having 2 mm or smaller pitch interval at the lattice area and 0.5 mm or smaller thickness of the lattice area, giving excellent performance in the whole performances such as moldability, flatness, warp-deformation, and heat resistance. A planar connector having a lattice structure within an outer frame is molded by using (C) a resin composition prepared by compounding (A) a liquid-crystalline polymer with (B) a fibrous filler, while the relation between the compounding quantity and the weight-average length of (B) the fibrous filler is controlled to a specified range.
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