The present invention provides a very thin planar connector having 2 mm or smaller pitch interval at the lattice area and 0.5 mm or smaller thickness of the lattice area, giving excellent performance in the whole performances such as moldability, flatness, warp-deformation, and heat resistance. A planar connector having a lattice structure within an outer frame is molded by using (C) a resin composition prepared by compounding (A) a liquid-crystalline polymer with (B) a fibrous filler, while the relation between the compounding quantity and the weight-average length of (B) the fibrous filler is controlled to a specified range.