US Patent 7790568 Method for fabricating semiconductor device
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Patent abstract
A method for fabricating a semiconductor device includes: providing a semiconductor substrate; forming a STI region on the semiconductor substrate; forming a channel region on the semiconductor substrate; implanting impurities into the STI region; and performing a thermal treatment to diffuse impurities to a side of the channel region.
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Patent Inventor Names
Tomohiro Okamura0
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Official Website
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US Patent 07790568 Method for fabricating semiconductor device US Patent 7790568 Method for fabricating semiconductor device
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Patent Number
077905680
Patent Number
77905680
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Patent Jurisdiction
Patent Number
077905680
Date of Patent
September 7, 2010
0Patent Application Number
115112770
Date Filed
August 29, 2006
0Official Website
Patent Primary Examiner
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US Patent 07790568 Method for fabricating semiconductor device
Infobox
Is a
Patent jurisdiction
Patent number
07790568
Date of patent
September 7, 2010
Patent application number
11511277
Date Filed
August 29, 2006
Patent primary examiner
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