US Patent 7803704 Reliable interconnects
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Patent abstract
A method for forming a semiconductor device is presented. The method includes providing a substrate prepared with a dielectric layer formed thereon. The dielectric layer having a conductive line disposed in an upper portion of the dielectric layer. The substrate is processed to produce a top surface of the dielectric layer that is not coplanar with a top surface of the conductive line to form a stepped topography.
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Patent Inventor Names
Bei Chao Zhang0
Bo Tao0
Chim Seng Seet0
Fan Zhang0
Juan Boon Tan0
Liang Choo Hsia0
Tong Qing Chen0
Yong Chiang Ee0
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US Patent 07803704 Reliable interconnects US Patent 7803704 Reliable interconnects
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Patent Number
078037040
Patent Number
78037040
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Official Website
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Patent Jurisdiction
Patent Number
078037040
Date of Patent
September 28, 2010
0Patent Application Number
121962910
Date Filed
August 22, 2008
0Official Website
Patent Primary Examiner
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US Patent 07803704 Reliable interconnects
Infobox
Is a
Patent jurisdiction
Patent number
07803704
Date of patent
September 28, 2010
Patent application number
12196291
Date Filed
August 22, 2008
Patent primary examiner
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