Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sukehiro Yamamoto0
Hiroaki Takasu0
Date of Patent
September 28, 2010
0Patent Application Number
123544230
Date Filed
January 15, 2009
0Patent Primary Examiner
Patent abstract
Provided is a semiconductor device, in which: patterns for detecting displacement at probing are formed of a plurality of minute conductors formed below a protective film; each of the plurality of minute conductors formed below the protective film is electrically insulated and formed to be smaller than a bottom surface of a tip of a probing needle used for carrying out an electrical measurement of IC chips; and the patterns for detecting displacement at probing are provided in a pair for each of the IC chips.
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