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US Patent 7829961 MEMS microphone package and method thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
November 21, 2007
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Date of Patent
November 9, 2010
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Patent Application Number
11943599
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Patent Citations Received
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US Patent 11916575 Digital microphone assembly with improved mismatch shaping
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US Patent 11780726 Dual-diaphragm assembly having center constraint
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US Patent 11787690 MEMS assembly substrates including a bond layer
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US Patent 11787688 Methods of forming MEMS diaphragms including corrugations
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US Patent 11909387 Microphone with slew rate controlled buffer
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US Patent 11671775 Microphone assembly with transducer sensitivity drift compensation and electrical circuit therefor
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US Patent 11662236 Sensor package with ingress protection
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US Patent 11772961 MEMS device with perimeter barometric relief pierce
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US Patent 11778390 Microphone assembly having a direct current bias circuit
Patent Inventor Names
Wei-Min Hsiao
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7829961
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Patent Primary Examiner
Bradley K. Smith
Bradley K. Smith
0

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