Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Satoshi Wakabayashi0
Tetsuji Togawa0
Hiroshi Sotozaki0
Koji Ato0
Ryuichi Kosuge0
Date of Patent
December 14, 2010
0Patent Application Number
104810010
Date Filed
April 9, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.
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