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US Patent 7850817 Polishing device and substrate processing device

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Patent Citations Received
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US Patent 12062563 Substrate processing apparatus, substrate processing system, and substrate processing method
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Patent abstract

A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.

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Patent Inventor Names
Hiroshi Sotozaki0
Koji Ato0
Ryuichi Kosuge0
Satoshi Wakabayashi0
Tetsuji Togawa0
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US Patent 07850817 Polishing device and substrate processing device US Patent 7850817 Polishing device and substrate processing device

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Patent Number
078508170
Patent Number
78508170
Edits on 25 May, 2023
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edited on 25 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=078508170
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edited on 23 Sep, 2022
Infobox
Is a
Patent
Patent
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
078508170
Date of Patent
December 14, 2010
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Patent Application Number
104810010
Date Filed
April 9, 2003
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=078508170
Patent Primary Examiner
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Sylvia R. MacArthur
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"Entity importer update"
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edited on 4 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07850817
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 US Patent 07850817 Polishing device and substrate processing device

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07850817
Date of patent
December 14, 2010
Patent application number
10481001
Date Filed
April 9, 2003
Patent primary examiner
‌
Sylvia R. MacArthur

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