US Patent 7852138 Thermal sensors for stacked dies
Patent 7852138 was granted and assigned to Nokia on December, 2010 by the United States Patent and Trademark Office.
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Patent abstract
The invention relates to a method for obtaining temperature values from at least two thermal sensors arranged on resources within a three-dimensional die structure determining at least a partial three-dimensional temperature distribution for said die structure and controlling activity of said resources of said dies in response to said three-dimensional temperature distribution.
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Patent Inventor Names
Jani Klint0
Kimmo Kuusilinna0
Tapio Hill0
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US Patent 07852138 Thermal sensors for stacked dies US Patent 7852138 Thermal sensors for stacked dies
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Patent Number
078521380
Patent Number
78521380
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Official Website
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Current Assignee
Patent Jurisdiction
Patent Number
078521380
Date of Patent
December 14, 2010
0Patent Application Number
123064500
Date Filed
December 24, 2007
0Official Website
Patent Primary Examiner
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US Patent 07852138 Thermal sensors for stacked dies
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07852138
Date of patent
December 14, 2010
Patent application number
12306450
Date Filed
December 24, 2007
Patent primary examiner
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