US Patent 7858499 Dicing tape and die attach adhesive with patterned backing
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Patent abstract
Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.
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Patent Inventor Names
David J. Plaut0
Eric G. Larson0
Joel A. Getschel0
Olester Benson, Jr.0
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US Patent 07858499 Dicing tape and die attach adhesive with patterned backing US Patent 7858499 Dicing tape and die attach adhesive with patterned backing
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Patent Number
07858499
Patent Number
7858499
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Official Website
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US Patent 07858499 Dicing tape and die attach adhesive with patterned backing
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Is a
Patent jurisdiction
Patent number
07858499
Date of patent
December 28, 2010
Patent application number
12399054
Date Filed
March 6, 2009
Patent primary examiner
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