Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 28, 2010
Patent Application Number
12358604
Date Filed
January 23, 2009
Patent Primary Examiner
Patent abstract
The present invention relates to a wire bonding structure, and more particularly to a manufacturing method for said wire bonding structure. The wire bonding structure comprises a die that connects with a lead via a bonding wire. At least one bond pad is positioned on an active surface of the die, and a gold bump is provided on the bond pad; furthermore, a ball bond can be positioned upon the gold bump. The bond pad and the gold bump can separate the ball bond and the die, which can avoid damaging the die during the bonding process.
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