US Patent 7859123 Wire bonding structure and manufacturing method thereof
All edits
Edits on 31 Oct, 2023
Golden AI
Edits made to:
Article (+552 characters)
Article
Patent abstract
The present invention relates to a wire bonding structure, and more particularly to a manufacturing method for said wire bonding structure. The wire bonding structure comprises a die that connects with a lead via a bonding wire. At least one bond pad is positioned on an active surface of the die, and a gold bump is provided on the bond pad; furthermore, a ball bond can be positioned upon the gold bump. The bond pad and the gold bump can separate the ball bond and the die, which can avoid damaging the die during the bonding process.
Edits on 22 Jul, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 22 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07859123 Wire bonding structure and manufacturing method thereof US Patent 7859123 Wire bonding structure and manufacturing method thereof
Infobox
Patent Number
0785912300
Patent Number
785912300
Edits on 27 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
078591230
Date of Patent
December 28, 2010
0Patent Application Number
123586040
Date Filed
January 23, 2009
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
078591230
Date of Patent
December 28, 2010
0Patent Application Number
123586040
Date Filed
January 23, 2009
0Official Website
Patent Primary Examiner
Edits on 4 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 6 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07859123 Wire bonding structure and manufacturing method thereof
Infobox
Is a
Patent jurisdiction
Patent number
07859123
Date of patent
December 28, 2010
Patent application number
12358604
Date Filed
January 23, 2009
Patent primary examiner
Find more entities like US Patent 7859123 Wire bonding structure and manufacturing method thereof
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
