Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Stephan Dobritz0
Harry Hedler0
Henning Mieth0
Date of Patent
January 11, 2011
0Patent Application Number
120238530
Date Filed
January 31, 2008
0Patent Primary Examiner
Patent abstract
A method for manufacturing a wafer level package of an integrated circuit element for direct attachment to a wiring board is disclosed. An integrated circuit element includes input/output pads located on an active side. A non-conductive support structure is formed on the active side of the integrated circuit element in an area that is free from input/output pads. A conductive path is formed upon the support structure and a non-conductive coating is formed on over the active side of the integrated circuit element such that a surface is formed which leaves interface pads accessible.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
