Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yun-jin Oh0
Date of Patent
January 11, 2011
0Patent Application Number
119827510
Date Filed
November 5, 2007
0Patent Primary Examiner
Patent abstract
Provided are a semiconductor package in which bonding pads of a semiconductor chip are electrically connected to interconnection portions by wire-bonding, and a method of manufacturing the semiconductor package. The semiconductor package includes: a substrate; an interconnection portion that is disposed on the substrate and comprises conductive patterns having a first thickness and conductive patterns having a second thickness that is smaller than the first thickness; at least one semiconductor chip that is mounted on the substrate and comprises a plurality of bonding pads; and a plurality of wires electrically connecting the conductive patterns and the bonding pads.
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