US Patent 7868460 Semiconductor package and method of manufacturing the same
Patent 7868460 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on January, 2011 by the United States Patent and Trademark Office.
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Provided are a semiconductor package in which bonding pads of a semiconductor chip are electrically connected to interconnection portions by wire-bonding, and a method of manufacturing the semiconductor package. The semiconductor package includes: a substrate; an interconnection portion that is disposed on the substrate and comprises conductive patterns having a first thickness and conductive patterns having a second thickness that is smaller than the first thickness; at least one semiconductor chip that is mounted on the substrate and comprises a plurality of bonding pads; and a plurality of wires electrically connecting the conductive patterns and the bonding pads.
US Patent 07868460 Semiconductor package and method of manufacturing the same US Patent 7868460 Semiconductor package and method of manufacturing the same
US Patent 07868460 Semiconductor package and method of manufacturing the same
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