Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ya-Lan Chuang0
Pei-Jung Tsai0
Shu-Ling Yeh0
Tang-Jung Wu0
Chih-Hsiang Lin0
Feng-Chih Chang0
Hsin-Ching Kao0
Date of Patent
January 18, 2011
0Patent Application Number
124185520
Date Filed
April 3, 2009
0Patent Primary Examiner
Patent abstract
Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
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