US Patent 7871835 Method for packaging light-emitting diode
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Patent abstract
Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
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Patent Inventor Names
Chih-Hsiang Lin0
Feng-Chih Chang0
Hsin-Ching Kao0
Pei-Jung Tsai0
Shu-Ling Yeh0
Tang-Jung Wu0
Ya-Lan Chuang0
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US Patent 07871835 Method for packaging light-emitting diode US Patent 7871835 Method for packaging light-emitting diode
Infobox
Patent Number
078718350
Patent Number
78718350
Edits on 22 Apr, 2023
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Patent Jurisdiction
Patent Number
078718350
Date of Patent
January 18, 2011
0Patent Application Number
124185520
Date Filed
April 3, 2009
0Official Website
Patent Primary Examiner
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US Patent 07871835 Method for packaging light-emitting diode
Infobox
Is a
Patent jurisdiction
Patent number
07871835
Date of patent
January 18, 2011
Patent application number
12418552
Date Filed
April 3, 2009
Patent primary examiner
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