Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 18, 2011
Patent Application Number
12425111
Date Filed
April 16, 2009
Patent Primary Examiner
Patent abstract
Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.
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