US Patent 7872869 Electronic chip module
Patent 7872869 was granted and assigned to Samsung on January, 2011 by the United States Patent and Trademark Office.
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Patent abstract
Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.
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US Patent 07872869 Electronic chip module US Patent 7872869 Electronic chip module
Infobox
Patent Number
0787286900
Patent Number
787286900
Edits on 28 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078728690
Date of Patent
January 18, 2011
0Patent Application Number
124251110
Date Filed
April 16, 2009
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078728690
Date of Patent
January 18, 2011
0Patent Application Number
124251110
Date Filed
April 16, 2009
0Official Website
Patent Primary Examiner
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US Patent 07872869 Electronic chip module
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07872869
Date of patent
January 18, 2011
Patent application number
12425111
Date Filed
April 16, 2009
Patent primary examiner
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