Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takashi Kariya0
Dongdong Wang0
Hajime Sakamoto0
Tadashi Sugiyama0
Date of Patent
February 8, 2011
0Patent Application Number
120345860
Date Filed
February 20, 2008
0Patent Primary Examiner
Patent abstract
A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole and reliability.
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