US Patent 7884286 Multilayer printed circuit board
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Patent abstract
A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole and reliability.
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Patent Inventor Names
Dongdong Wang0
Hajime Sakamoto0
Tadashi Sugiyama0
Takashi Kariya0
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US Patent 07884286 Multilayer printed circuit board US Patent 7884286 Multilayer printed circuit board
Infobox
Patent Number
078842860
Patent Number
78842860
Edits on 19 May, 2023
Golden AI
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Official Website
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Infobox
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Patent Jurisdiction
Patent Number
078842860
Date of Patent
February 8, 2011
0Patent Application Number
120345860
Date Filed
February 20, 2008
0Official Website
Patent Primary Examiner
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US Patent 07884286 Multilayer printed circuit board
Infobox
Is a
Patent jurisdiction
Patent number
07884286
Date of patent
February 8, 2011
Patent application number
12034586
Date Filed
February 20, 2008
Patent primary examiner
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